The project titled “Thermal Analysis Simulation of Semiconductor Packages using Thermal Interface Materials enhanced with Boron Nitride Nanotube (BNNT)” aims to address the challenge of heat management in modern semiconductor devices with high power densities. This project will focus on modeling the thermal performance of semiconductor packages using TIMs enhanced with boron nitride nanotubes (BNNTs). The modeling is intended to provide valuable insights into potential improvements in heat dissipation and overall thermal management efficiency.