CAEDMI Alpha Institute of Technology (AIT) has initiated an advanced research project titled “Thermal Analysis Simulation of Semiconductor Packages using Thermal Interface Materials enhanced with Boron Nitride Nanotube (BNNT).” This project aims to tackle the challenges of heat management in high-power semiconductor devices by modeling the thermal performance of semiconductor packages using TIMs (Thermal Interface Materials) enhanced with boron nitride nanotubes. The research will provide critical insights into improving heat dissipation and boosting overall thermal management efficiency.
The project brings together CAEDMI Rector David Lim, engineers from THE Tech, AIT students, and Senior Instructor of Mechanical Engineering Joseph Hague, working in partnership with Naieel Technology. Key objectives include developing a simulation model for thermal analysis, assessing the thermal conductivity and resistance of BNNT-enhanced TIMs, and comparing their performance against conventional TIMs. This collaborative effort has the potential to significantly enhance the thermal stability and efficiency of semiconductor devices in demanding applications.